W. Kinzy Jones
IMAPS Fellow
MIT ‘72
Fall ‘85
(305) 348-2345

Degrees with Fields, Institution, and Date:

Ph.D. Materials Science, Massachusetts Institute of Technology, 1972
M.S. Metallurgy, Florida State University, 1968
B.S. Engineering Science, Florida State University, 1967

Number of Years Service of this Faculty, Date of Original Appointment and Dates of Advancement in Rank:

17 Years
Associate Dean, College of Engineering, 1994-1997
Professor, Florida International University, 1992-Present
Associate Professor/Director Biomedical Research, FIU 1986
Associate Professor/Chairman, Florida International University, 1985-1986

Other Related Experience:

Cordis Corporation, Miami, Florida, Manager, Pacer Engineering (80 professionals), various other positions (1977-1985)

C.S. Draper Laboratory (formerly MIT Instrumentation Lab), Cambridge, Mass. Group Head, Materials Engineering (1972-1977)

Consulting, Patents, etc.:

4 US patents
CPS Corporation, Miami, FL
Heraeus Corporation, Conshohocken, PA
Harris Corporation, Melbourne, FL
Medical Research Group, Silmar, CA

State in which registered: N/A

Principal Publications (Last five years):

Wang, P., Jones, W.K., and Liu, Y., Thick Silver Tape in Low Temperature Cofire Ceramic (LTCC) for Thermal Management, Proc. 2001 International Microelectronics Conference, IMAPS, Baltimore, MD, 2001.

Jones, W.K., Wang,P., and Liu, Y., Thermal Management in LTCC Technology, Proc. INTERPACK, ASME, Kauai, HI, 2001.

W. K. Jones, Y. Liu, P. Wang, and M. Zampino, Chemical, Structural and Mechanical Properties of LTCC Tapes, Int. J. Microcircuits and Electronic Packaging, Vol. 23,, No. 4, 2000.

Barnwell, P., Free,C., Jones,W.K, and MacDonald,N., High Frequency Performance of LTCC Materials, Proc. 2000 International Microelectronics Conference, IMAPS, Boston, 2000.

Zampino, M.A., Jones, W.K., and Cao, Y., Substrate Embedded Heat Pipes Compatible With Ceramic Cofire Processing, Int. J. Microcircuits and Electronic Packaging, Vol. 21, No. 1, pp. 52-58, 1998.

Jones, W.K.,Liu,Y.,Shah,M.,and Clarke,R., Mechanical Properties of Sb/Sn, Pb/In ands Sn/In Solders, Soldering and Surface Mount Technology, Vol.10,No.1, pps. 37-41, 1998.

Jones,W.K., Liu,Y., Zampino,M., and Gonzalez,G, The At-Temperature Mechanical Properties of Lead-Tin Based Solders from –200 °C to 150 °C, Journal of Microcircuits and Electronic Packaging, Vol. 20,2, 1997.

Schardt, C. and Jones, W.K., Cofired A1N Pad Grid MCM-C/D for High Speed Digital Applications, International Journal of Microcircuits and Electronic Packaging, 15 (3), pp. 272-279.

Scientific and professional societies of which a member:


Honors and Awards:

Daniel C. Hughes Award, International Microelectronics and Packaging Society (IMAPS). (1996)

Wagnon Technical Achievement Award, IMAPS, awarded for the development of advanced microelectronic packaging concepts 1999

1992 Fellow of the International Society of Hybrid Microelectronics.

2001, 1991 Faculty Award for Excellence in Research, Florida International University, Honorary Degree and Awards Committee of the Faculty Senate.

2002, Teaching Incentive Program (TIP) award for excellence in teaching

1990 Achievement Award, FIU, in recognition of the pursuit of excellence.

Who’s Who in America, Marquis, 2000, 2002

Who’s Who in the World, Marquis, 1999, 2001

Institutional and Professional Services (Last five years):

Florida Manufacturing Extension Partnership, a NIST MEP Network Affiliate, State Board of Directors- South Florida Manufacturing Technology Center, Board of Directors (1996-1999), Board of Advisors (1999).

Trustee, IMAPS Educational Foundation, 1995- present

Technical Co-Chair, 1st, 2nd ,and 3rd International Conference on Electronic Packaging, Peoples Republic of China (1994,1996,1998).

Organizing Committee: NATO Advanced Research Workshop (ARW) on Microelectronic Interconnections and Microassembly, Prague, Czech Republic, 1996, 1st International Conference on electronic Packaging, India,(1997), 1st Microelectronics Conference, Israel, 1998.

Professional Development Activities (Last five years):

ATMI (1998 – 2000), Sterling semiconductor, Inc. (1998-2000).